| 无铅覆铜板增韧技术概述及表征 |
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| 引用本文： | 吴奕辉,方克洪.无铅覆铜板增韧技术概述及表征[J].印制电路信息,2010(11):13-16. |
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| 作者姓名： | 吴奕辉 方克洪 |
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| 作者单位： | 广东生益科技股份有限公司,广东东莞523039 |
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| 摘 要： | 阐述了近年来应用于无铅覆铜板的几种增韧技术,通过对增韧技术的综合运用,制备出一款具备良好韧性的高Tg无铅覆铜板,对其韧性进行定性表征,提出了快速简便的覆铜板韧性测试方法。
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| 关 键 词： | 增韧 层间粘合力 落锤冲击 钻孔晕圈 覆铜板 |
The methods and characterization of toughness in lead-free copper clad laminate |
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| WU Yi-hui,FANG Ke-hong.The methods and characterization of toughness in lead-free copper clad laminate[J].Printed Circuit Information,2010(11):13-16. |
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| Authors: | WU Yi-hui FANG Ke-hong |
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| Affiliation: | WU Yi-hui FANG Ke-hong |
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| Abstract: | Several methods for increasing the toughness of Lead-Free laminate in recent years have been elaborated.On the basis of using the complex toughening methods,a high Tg Lead-Free laminate with good toughness has been developed.For the purpose of qualitative characterization of toughness,several quick and easy toughness testing methods have been proposed. |
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| Keywords: | toughening layer adhesion drop weight impact test drilling halo copper clad laminate |
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