| 串联MEMS开关的瞬态电磁场分析 |
| |
| 引用本文： | 顾洪明,吕苗,单福琪,高葆新,梁春广. 串联MEMS开关的瞬态电磁场分析[J]. 微纳电子技术, 2003, 0(Z1) |
| |
| 作者姓名： | 顾洪明 吕苗 单福琪 高葆新 梁春广 |
| |
| 作者单位： | 清华大学电子工程系 北京100084(顾洪明，单福琪，高葆新)，河北半导体研究所 河北石家庄050002(吕苗)，河北半导体研究所 河北石家庄050002(梁春广) |
| |
| 摘 要： | 提出了一种串联MEMS开关的电磁耦合模型 ,并且应用该模型 ,对采用表面硅工艺和体硅工艺制作的MEMS开关 ,采用全波分析方法 ,进行了瞬态电磁场分析。由于开关尺寸为微米量级 ,而驱动电压高达 4 0～ 6 0V ,这样的瞬态高压有可能对开关上的信号产生影响。理论仿真结果显示 ,开关驱动路对信号路有很强的耦合场存在。实验结果同样显示 ,耦合到信号路的信号可以输入信号产生最大值为 6 0 %的失真
|
| 关 键 词： | MEMS开关 耦合模型 全波分析法 |
Transient field analysis for series MEMS switch |
| |
| GU Hong ming ,L Miao ,SHAN Fu qi ,GAO Bao xin ,LIANG Chun guang. Transient field analysis for series MEMS switch[J]. Micronanoelectronic Technology, 2003, 0(Z1) |
| |
| Authors: | GU Hong ming L Miao SHAN Fu qi GAO Bao xin LIANG Chun guang |
| |
| Affiliation: | GU Hong ming 1,L Miao 2,SHAN Fu qi 1,GAO Bao xin 1,LIANG Chun guang 2 |
| |
| Abstract: | A coupling model for both the surface and bulk micromachining is presented to fabricate series metal contact MEMS switch. The typical capacitor matrix and coupling coefficient has been computed using full wave analysis method. Since the switch dimension is only several hundred microns and the actuation voltage is 40～60V, the transient high voltage on the actuation path will couple to the signal line. The coupled voltage from actuation voltage will greatly affect the signal, because the signal current passing through the switch is typically only about 1 mA, This phenomenon has been observed in out experiment with the signal distortion about 60%. |
| |
| Keywords: | MEMS switch coupled mode full wave analysis method |
| 本文献已被 CNKI 等数据库收录！ |
|
