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基于温度场建模的SVG热力学响应研究
引用本文:王立国,吕琳琳,吴松霖,徐殿国,武健.基于温度场建模的SVG热力学响应研究[J].电源学报,2013,11(3):37-41.
作者姓名:王立国  吕琳琳  吴松霖  徐殿国  武健
作者单位:哈尔滨工业大学电气工程及自动化学院,哈尔滨工业大学电气工程及自动化学院电气工程系,哈尔滨工业大学电气工程及自动化学院,哈尔滨工业大学电气工程及自动化学院,哈尔滨工业大学电气工程及自动化学院
基金项目:国家自然科学基金资助项目(50877016,50877017);中国博士后基金资助项目(20100471063,20090238550877016)
摘    要:鉴于SVG逆变桥IGBT的过热故障,进行IGBT热力学故障发生机理分析,进行故障状态下SVG三维稳态温度场建模分析。为确定ANSYS workbench热力学仿真的边界条件,通过Fourier定律和能量守恒定律分析,推导模拟导热微分方程的边界条件表达式;给出IGBT不同温度条件下热损耗及其与温度间的变化规律。基于所建立Solidworks空间模型进行SVG三维温度场模拟。仿真结果与IGBT温耗曲线及热成像仪实测结果相印证,可为模拟IGBT过热故障瞬间的温度场变化奠定理论分析基础。

关 键 词:温度场建模  IGBT损耗  热力学响应  SVG
收稿时间:2011/11/14 0:00:00
修稿时间:2011/12/7 0:00:00

SVG THERMODYNAMIC RESPONSE BASED ON TEMPERATURE MODELING
WANG Li-guo,LV Lin-lin,WU Song-lin,XU Dian-guo and WU Jian.SVG THERMODYNAMIC RESPONSE BASED ON TEMPERATURE MODELING[J].Journal of power supply,2013,11(3):37-41.
Authors:WANG Li-guo  LV Lin-lin  WU Song-lin  XU Dian-guo and WU Jian
Affiliation:Dept. of Electrical Engineering, Harbin Institute of Technology,Dept. of Electrical Engineering, Harbin Institute of Technology,Dept. of Electrical Engineering, Harbin Institute of Technology,Dept. of Electrical Engineering, Harbin Institute of Technology,Dept. of Electrical Engineering, Harbin Institute of Technology
Abstract:In view of the IGBT overheating failure of the SVG inverter bridge,the thermodynamic failure mechanisms of IGBT was analyzed.To determine the boundary conditions of ANSYS workbench thermodynamic simulation,by Fourier's law and the law of conservation,the boundary conditions expression of heat conduction equation was derived;IGBT's heat loss and its temperature variation was given under different temperature conditions.The simulation results were corresponded to IGBT temperature consumption curve and thermal imaging's results.The simulation lays the theoretical basis for IGBT instantaneous temperature changes.
Keywords:temperature field modeling  IGBT losses  thermodynamic response  SVG
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