Mechanical, thermal, and electrical analysis of a compliant interconnect |
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Authors: | Galloway J Syed A WonJoon Kang JinYoung Kim Cannis J Ka Y SeungMo Kim TaeSeong Kim GiSong Lee SangHyun Ryu |
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Affiliation: | Amkor Technol., Chandler, AZ, USA; |
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Abstract: | Ball grid array (BGA) package styles use solder balls as electrical interconnects between packages and application boards. Solder balls are rigid and tend to fracture under thermal fatigue and/or shock loading. Metalized polymer spheres (MPS) offer a more compliant interconnect, compared to solder balls, thereby increasing the thermal cycling fatigue life. A reduction in thermal and electrical performance may be expected for MPS interconnects as a result of its higher thermal and electrical resistances. A 5% and an 8% increase in MPS thermal resistance was measured for a carrier array ball grid array (CABGA) package and a plastic ball grid array (PBGA) package, respectively, compared to eutectic solder balls. However, this small reduction was offset by large gains in the solder joint life. A 1.6 times increase in the mean thermal fatigue life was measured for a CABGA using MPS interconnects compared to eutectic solder balls. A first-order model showed that eutectic solder balls provide greater process margins, compared to MPS interconnects, due to the ball collapse during reflow. |
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