| 导电胶粘剂的研究发展现状 |
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| 引用本文： | 陈建军,邱浩孟,李和昌,缪明松,MIAO Ming-son. 导电胶粘剂的研究发展现状[J]. 粘接, 2009, 30(8): 68-71 |
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| 作者姓名： | 陈建军 邱浩孟 李和昌 缪明松 MIAO Ming-son |
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| 作者单位： | 广州市白云化工实业有限公司,广东广州,510540 |
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| 摘 要： | 介绍了导电胶的应用、分类和导电机理，并按导电填料进行分类分别介绍了各类导电胶的发展现状，最后对今后的研究方向进行了展望。
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| 关 键 词： | 导电胶 导电机理 导电填料 现状 |
Present situation of research and development of conductive adhesive |
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| CHEN Jian-jun,QIU Hao-meng,HUANG Kai,LI He-chang,MIAO Ming-son. Present situation of research and development of conductive adhesive[J]. Adhesion in China, 2009, 30(8): 68-71 |
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| Authors: | CHEN Jian-jun QIU Hao-meng HUANG Kai LI He-chang MIAO Ming-son |
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| Affiliation: | CHEN Jian-jun ,QIU Hao-meng, HUANG Kai,LI He-chang,MIAO Ming-son (Guangzhou Baiyun Chemical Industry Co., Ltd., Guangzhou,Guangdong 510540,China) |
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| Abstract: | This article introduced the application ,classification and electrical conduction mechanism of conductive adhesive. It also presented the status quo ofverious conductive adhesives classified by conductive fillier and the prospect of research direction. |
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| Keywords: | conductive adhesive electrical conduction mechanism conductive filler present situation |
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