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表面贴装关键技术综述
引用本文:罗磊,王石刚,蔡建国. 表面贴装关键技术综述[J]. 组合机床与自动化加工技术, 2003, 0(2): 70-72
作者姓名:罗磊  王石刚  蔡建国
作者单位:上海交通大学,机械与动力工程学院,上海,200030
摘    要:通过对表面贴装技术(Surface Mount Technology,简称SMT)发展状况的分析。归纳出SMT设备的关键技术。作者认为通过建立高性能表面贴装智能控制体系结构和控制方法能够解决信息产业SMT领域对表面贴装高速化,高精度化,智能化,柔性化的性能需求,并提出模块组合,功能分离,结构开放,高效柔性的表面贴装设备结构。通过对关键技术做进一步研究,可为表面贴装装备的开发和产品化提供理论和实际依据。

关 键 词:表面贴装技术 智能控制 功能分离
文章编号:1001-2265(2003)02-0070-03
修稿时间:2002-08-13

The survey of key technologies of SMT
LUO Lei WANG Shigang CAI Jianguo. The survey of key technologies of SMT[J]. Modular Machine Tool & Automatic Manufacturing Technique, 2003, 0(2): 70-72
Authors:LUO Lei WANG Shigang CAI Jianguo
Affiliation:LUO Lei WANG Shigang CAI Jianguo
Abstract:By analyzing the state-of-the-art key technologies of SMT, the authors summarize the key elements of SMT in this paper. It is proposed that the requirements of the SMT, namely high speed, high precision, intelligence and flexibility can be met by establishing intelligent control architecture and control methods. The authors also put forward the architecture for surface mount devices which is characterized as modules combined, functions separated, open system architecture and highly efficient & flexible. Theoretical and practical data to be used in the R&D of the equipments can be obtained via further research about the key technologies.
Keywords:surface mount technology(SMT)  intelligent control  functions separated
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