| 分立器件封装及其主流类型 |
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| 引用本文： | 龙乐.分立器件封装及其主流类型[J].电子与封装,2005,5(2):12-17. |
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| 作者姓名： | 龙乐 |
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| 作者单位： | 龙泉长柏路98号1栋208室,四川,成都,610100 |
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| 摘 要： | 分立器件封装也是微电子生产技术的基础和先导。本文介绍国内外半导体分立器件封装技术及产品的主要发展状况,评述了其商贸市场的发展趋势。
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| 关 键 词： | 半导体 封装 分立器件 |
| 文章编号： | 1681-1070(2005)02-12-6 |
| 修稿时间： | 2004年9月16日 |
Discrete Device Packaging and Its Typical Types |
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| Long Le.Discrete Device Packaging and Its Typical Types[J].Electronics & Packaging,2005,5(2):12-17. |
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| Authors: | Long Le |
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| Abstract: | Discrete device packaging is one of the basis and the pioneer of microelectronic technology. An overall review of the main development of technology and productions for semiconductor discrete device packaging is made in this paper. The business and market developing trend for these devices are described too. |
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| Keywords: | Semiconductor Packaging Discrete Device |
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