| Ag-Au-Ge钎料润湿性的研究 |
| |
| 引用本文： | 崔大田,王志法,姜国圣,吴泓,何平. Ag-Au-Ge钎料润湿性的研究[J]. 矿冶工程, 2006, 26(1): 88-90 |
| |
| 作者姓名： | 崔大田 王志法 姜国圣 吴泓 何平 |
| |
| 作者单位： | 中南大学,材料科学与工程学院,湖南,长沙,410083;中南大学,材料科学与工程学院,湖南,长沙,410083;中南大学,材料科学与工程学院,湖南,长沙,410083;中南大学,材料科学与工程学院,湖南,长沙,410083;中南大学,材料科学与工程学院,湖南,长沙,410083 |
| |
| 基金项目： | 国家高新工程重点项目（DZ-2002-021） |
| |
| 摘 要： | 通过对Ag-Au-Ge系三元相图的分析研究, 初步研制了熔化温度在490 ℃的Ag-Au-Ge钎料合金, 并对其润湿性进行了测试。润湿性测试结果表明: 温度在熔点以上60 ℃范围内时, Ag-Au-Ge钎料合金与Ni板润湿性良好。
|
| 关 键 词： | Ag-Au-Ge 钎料 润湿性 钎焊温度 |
| 文章编号： | 0253-6099(2006)01-0088-03 |
| 收稿时间： | 2005-06-17 |
| 修稿时间： | 2005-06-17 |
A Study on The Wettability of Au-Ag-Ge Solder |
| |
| CUI Da-tian,WANG Zhi-fa,JIANG Guo-sheng,WU Hong,HE Ping. A Study on The Wettability of Au-Ag-Ge Solder[J]. Mining and Metallurgical Engineering, 2006, 26(1): 88-90 |
| |
| Authors: | CUI Da-tian WANG Zhi-fa JIANG Guo-sheng WU Hong HE Ping |
| |
| Affiliation: | School of Material Science and Engineering, Central South University, Changsha 410083, Hunan,China |
| |
| Abstract: | On the basis of analyzing the ternary phase diagram of Ag-Au-Ge eutectic alloys, Ag-Au-Ge solder with a melting temperature of 490 ℃ was developed. The wettability of the solder was tested as well. The results showed that the solder had a good wettability to Ni plate at the temperature within 60 ℃ above the solder's melting point. |
| |
| Keywords: | Ag-Au-Ge solder wettability soldering temperature |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
| 点击此处可从《矿冶工程》浏览原始摘要信息 |
|
点击此处可从《矿冶工程》下载全文 |
|
