| 自主知识产权产品LIP封装 |
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| 引用本文： | 郭小伟.自主知识产权产品LIP封装[J].电子工业专用设备,2008,37(1):31-33. |
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| 作者姓名： | 郭小伟 |
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| 作者单位： | 天水华天科技股份有限公司,甘肃,天水,741000 |
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| 摘 要： | 为解决QFN成本较高的问题和进一步提高产品可靠性,华天科技突破了传统思想的束缚,在产品结构的设计上进行了创新。引脚在封装本体内式封装(LIP:Lead In Package)是一种新型的封装形式,它是针对目前QFN(Quad Flat No-lead)在封装高成本问题而重新选择的设计方案。
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| 关 键 词： | 自主知识产权 本体内式封装 QFN封装 |
| 文章编号： | 1004-4507（2008）01-0030-03 |
| 收稿时间： | 2007-12-25 |
| 修稿时间： | 2007年12月25 |
Independent Intellectual Property Product LIP Package of Huatian Technology |
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| GUO Xiao-wei.Independent Intellectual Property Product LIP Package of Huatian Technology[J].Equipment for Electronic Products Marufacturing,2008,37(1):31-33. |
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| Authors: | GUO Xiao-wei |
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| Abstract: | To resolve the issue of high costs exists in QFN packaging and further improve the product reliability,we made a breakthrough in the shackles of traditional thinking,and innovated in the design of product structure. Leads within the package (LIP: Lead In Package) is a new form of packaging. It is the new design resolution to deal with the high packaging cost problem existed in current QFN (Quad Flat No-lead) packaging. |
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| Keywords: | Independent Intellectual Property Lead In Package(LIP) Quad Flat No-lead(QFN) |
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