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铝线键合的等离子清洗工艺研究
引用本文:钟小刚. 铝线键合的等离子清洗工艺研究[J]. 电子与封装, 2014, 0(4): 31-33,41
作者姓名:钟小刚
作者单位:广东风华芯电科技股份有限公司,广州510663
摘    要:采用DOE(实验设计)方法,通过比较铝线拉力的数值、标准方差及PpK,得到最适合铝线键合工艺的等离子清洗功率、时间和气流速度参数的组合。同时分析了引线框架在料盒中的摆放位置对等离子清洗效果的影响,引线框架置于等离子气体浓度高的位置清洗效果较好,引线拉力值能获得更低的方差和更优的过程控制能力。

关 键 词:等离子清洗  铝线  DOE

Study on Plasma Cleaning Process of Aluminium Wire Bonding
ZHONG Xiaogang. Study on Plasma Cleaning Process of Aluminium Wire Bonding[J]. Electronics & Packaging, 2014, 0(4): 31-33,41
Authors:ZHONG Xiaogang
Affiliation:ZHONG Xiaogang ( Guangdong Fenghua Semiconductor Technology Co.,Ltd, Guangzhou 510663, China)
Abstract:DOE is used to optimize the parameter combination as power, timing and velocity in plasma cleaning, by comparing the pull strength value, STD and PpK. And analyzed the influence of leadframe position in the magzine with plasma cleaning effect, the leadframe where exposed in high density of plasma atmosphere is superior to others in cleaning effect, such as higher bonding pull strength, lower STD and excellent process control ability.
Keywords:plasma cleaning  aluminium wire  DOE
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