| 含氮酚醛在无卤覆铜板中的应用研究 |
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| 引用本文： | 李杰,王碧武,何岳山. 含氮酚醛在无卤覆铜板中的应用研究[J]. 印制电路信息, 2009, 0(11): 19-22,27 |
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| 作者姓名： | 李杰 王碧武 何岳山 |
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| 作者单位： | 广东生益科技股份有限公司,广东,东莞,523039 |
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| 摘 要： | 采用含氮酚醛固化含磷环氧，成功开发出综合性能优良的无卤覆铜板。比较了线性酚醛和含氮酚醛固化’行为，系统考察了不同结构的含氮酚醛树脂及其用量对无卤板材性能的影响。
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| 关 键 词： | 无卤 含氮酚醛 阻燃 覆铜板 |
Study on Application of Nitrogen-Containing Phenolic Resin in Halogen-Free Copper Clad Laminate |
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| LI Jie,WANG Bi-wu,HE Yue-shan. Study on Application of Nitrogen-Containing Phenolic Resin in Halogen-Free Copper Clad Laminate[J]. Printed Circuit Information, 2009, 0(11): 19-22,27 |
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| Authors: | LI Jie WANG Bi-wu HE Yue-shan |
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| Affiliation: | LI Jie WANG Bi-wu HE Yue-shan |
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| Abstract: | The nitrogen-containing phenolic resin was used as curing agent in phosphorous epoxy, and ahalogen-free copper clad laminate with comprehensive performance successfully was developed. The curing behavior of linear phenolic resin and nitrogen-containing phenolic resin was compared. The effect on the properties of halogen-free copper clad laminate were studied by nitrogen-containing phenolic resin with the different structure and the amount. |
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| Keywords: | halogen-free nitrogen-containing phenolic resin flame retardant Copper Clad Laminate |
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