| CPU干刻清洗工艺在金属刻蚀去胶腔上的评价及应用 |
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| 引用本文： | 王倩. CPU干刻清洗工艺在金属刻蚀去胶腔上的评价及应用[J]. 数字社区&智能家居, 2006, 0(10): 142-144 |
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| 作者姓名： | 王倩 |
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| 作者单位： | [1]上海交通大学微电子学院,上海200030 [2]上海华虹NEC电子有限公司,上海201206 |
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| 摘 要： | 本文以CPU金属刻蚀去胶腔为背景，简述干刻清洗工艺开发和评价过程。针对实际应用中的问题，展开讨论。通过实际案例分析．展示了CPU干刻清洗工艺的应用价值。
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| 关 键 词： | CPU干刻清洗 金属刻蚀 干刻 去胶腔 去胶速率 |
| 文章编号： | 1009-3044（2006）29-0142-03 |
| 收稿时间： | 2006-07-21 |
| 修稿时间： | 2006-07-21 |
The Evaluation and Application of CPU Dry Clean Process on Ash Chamber of Metal Etch |
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| WANG Qian. The Evaluation and Application of CPU Dry Clean Process on Ash Chamber of Metal Etch[J]. Digital Community & Smart Home, 2006, 0(10): 142-144 |
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| Authors: | WANG Qian |
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| Abstract: | Based on ash chamber of metal etch, this paper describes the full process of dry clean development and evaluation. And the related issue among process application is also discussed. Through the analysis of actual case, the worth of dry clean application is presented. |
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| Keywords: | CPU Dry Clean Metal Etch Dry Etch Ash Chamber Ash Rate |
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