轧制烧结法制取铜合金基体-金刚石薄刀片

本文介绍了电子工业中广泛采用的切割半导体晶片和基片的金刚石薄刀片的基本特点和技术要求;概述了粉末冶金法制取铜合金基体-金刚石薄刀片的基体材料、工艺流程和几个关键工序。对刀片的主要技术参数测定和切割试验分析表明,铜合金基体-金刚石薄刀片完全符合使用技术要求。

Research and Manufacture of Copper Alloy Based Diamond thin Blades

The main characteristies and technical requirements on the application of thin diamond blades widely used in electronic industries for cutting base sheet wafer in semiconductors are presented in this paper. The base meterials and key procedures for producing copper alloy based diamond thin blades by powder metallurgy are summarized. The copper alloy based iamond thin blades were proved to be satisfactorily met the technical requirements by measuring the parameters of the blades and anayzing the results of cutting tests.