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New approach to enhance adhesions between carbon nanotube emitters and substrate by the combination of electrophoresis and successive electroplating |
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| Authors: | Woo Yong Sung Seung Min Lee Wal Jun Kim Jong Girl Ok Ho Young Lee Yong Hyup Kim |
| Affiliation: | aSchool of Mechanical and Aerospace Engineering and the Institute of Advanced Aerospace Technology, Seoul National University, Sillim-dong, Gwanak-gu, Seoul 151-742, Republic of Korea bAdvanced Materials and Process Research Center for IT, Sunkkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea |
| Abstract: | Complementary electroplating combined with electrophoresis enhanced the field emission characteristics of emitters by improving the adhesions between CNT emitters and substrate. The emitting current of the CNT emitters prepared by our combined method increased nine times higher than that of CNT emitters prepared by electrophoresis only, since electroplating improved the adhesion of CNT emitters. During the life-time measurement for 10 h, the emitting current of CNT emitters fabricated by electrophoresis only was drastically decreased to 13% of the initial current, while that prepared by the combination of electrophoresis and successive electroplating decreased to 64% of the initial current. We suggest that our method is a promising approach for the efficient fabrication of reliable CNT emitters. |
| Keywords: | Carbon nanotubes Field emission Electrophoresis Electroplating Adhesion |
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