|
|||||
|
|
Development of Silica Polyvinyl Alcohol Wheels for Wet Mirror Grinding of Silicon Wafer |
|
| Authors: | Y. Tani S. Murai H. Sato |
| Affiliation: | 1 Department of Mechanical Engineering, College of Science and Engineering, Ritsumeikan University Nojirihigashi 1-1-1, Kusatsu, Siga 525-8577 Japan 2 Research Center, Toyobo Co. Ltd., Otsu, Shiga, Japan 3 Nippei Toyama Corporation, Toyama, Japan 4 Institute of Industrial Science, University of Tokyo, Tokyo, Japan |
| Abstract: | It is strongly desired to develop a cup grinding wheel which enables mirror finishing of a device wafer on the same machine after back grinding. Silica wheels have the capability of mirror finish in a dry condition but there remain serious problems in flatness and thermal damage to a dicing tape. A new silica wheel which can be used in a wet condition has been developed. The PVA (polyvinyl alcohol) was adopted as the bonding agent, by which the absorbent swell resulted in disturbance of water infiltration to the inside in cup grinding. A series of experiments show that mirror finishing will be achieved within 2 min. This could not be accomplished utilizing phenol wheels. |
| Keywords: | Grinding Silicon Wafer Mirror Finishing |
| 本文献已被 ScienceDirect 等数据库收录！ | |