| 热残余应力对C/SiC复合材料界面剪切强度影响的有限元分析 |
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| 引用本文： | 李巾锭,吕哲,任成祖,陈光,董静川. 热残余应力对C/SiC复合材料界面剪切强度影响的有限元分析[J]. 材料科学与工程学报, 2017, 0(5): 801-805 |
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| 作者姓名： | 李巾锭 吕哲 任成祖 陈光 董静川 |
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| 作者单位： | 1. 机构理论与装备设计教育部重点实验室,天津大学,天津300072;天津市装备设计与制造技术重点实验室,天津大学,天津300072;2. 天津市特种设备监督检验技术研究院,天津,300192 |
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| 基金项目： | 国家自然科学基金资助项目，教育部博士点基金资助项目 |
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| 摘 要： | 根据C/SiC复合材料的属性,建立单纤维顶出的二维轴对称模型,采用有限元法对C/SiC复合材料的界面剪切强度进行数值研究,分析中考虑材料制备过程中的残余应力对界面剪切强度的影响,在细观力学层面上系统分析纤维顶出过程的界面剪应力及其相关影响因素。分析得出,残余应力会对界面造成损伤,降低界面脱粘载荷。材料的界面承受能力与热膨胀系数呈正相关,与固化温度呈负相关。
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| 关 键 词： | 热残余应力 C/SiC 复合材料 界面剪切强度 |
Finite Element Simulation of Interface Shear Strength of C/SiC Composites with Thermal Residual Stress |
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| Abstract: | Considering the influence of residual stress on interface shear strength in the preparation process of C/SiC composite material,a two-dimensional axisymmetric model of single fiber push-out was established to study the interface shear strength of the C/SiC composites by finite element method.The interface shear stress and its related influencing factors in the push-out process were analyzed in the mesoscopic mechanical level.It was analyzed that the residual stress can cause damage to the interface,reduce the interface debonding load.The interface capacity was positively correlated with the thermal expansion coefficient,and negatively correlated with curing temperature. |
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| Keywords: | residual stress C/SiC composite interface shear strength |
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