埋铜块板起泡改善

通过对埋铜块板板面起泡缺陷板特征分析，基于不同铆钉调钉高度、不同铝片及不同铆钉位置等设计以及关键流程制作方法分析，得出埋铜块板板面起泡的可能影响因素。通过设计对比验证试验，发现陶瓷磨板参数、铆钉孔位置是影响埋铜块板板面起泡的主要因素，并通过调整陶瓷磨板参数、减少铆钉孔数量，解决了埋铜块板板面起泡缺陷。

Improvement of blister in embedded coin PCB

The factors of board surface blister of embedded coin board are obtained by the analysis of defect characteristic and design information such as rivet height aluminum sheet, rivet position and critical processing. After several contrast and veriifcation experiments, ceramics milling parameters and rivet position are deifned to be crucial factor of board surface blister of embedded board. Finally, the blister problems are solved after adjusting ceramics milling parameters and reduce rivet number.