导热绝缘层的韧性及附着力影响因素分析

铝基覆铜板作为电子元器件的载体，以其优异的散热性能，广泛应用于LED、汽车、电视、电源等领域。但由于铝基覆铜板的导热绝缘层附着力差，且导热绝缘层本身韧性低，机械加工时容易出现导热绝缘层崩裂、分层的现象，这是铝基覆铜板开发及制作过程中面临的最大难题之一。本文采用柱轴弯曲试验来评估导热绝缘层的韧性及附着力，并分析了影响铝基覆铜板导热绝缘层韧性及附着力的因素，从试验条件、铝板表面处理方式、导热绝缘层厚度、导热绝缘层配方等方面进行对比，评估不同因素对韧性及附着力的影响情况。

Analysis on factors inlfuencing toughness and adhesion of insulating thermal conductive layer

Aluminum base copper clad laminate as the carrier of electronic components, with its excellent thermal performance, is widely used in LED, automotive, TV, power supply etc.. But the insulating thermal conductive layer of aluminum base copper clad laminate has poor adhesion and toughness, it is prone to fall off while machining, which is one of the most dififcult troubles on aluminum base copper clad laminate. In this paper, bend test （cylindrical mandrel） was used to evaluate the toughness and adhesion of insulating thermal conductive layer, and analyzed on factors influencing toughness and adhesion of insulating thermal conductive layer. Then contrast from the test condition, aluminum surface treatment, thickness and formula of insulating thermal conductive laye etc., evaluating the effect on the toughness and adhesion.