活性酯固化环氧基高介电常数覆铜板的研制简

当前各界对于天线设计的重点在于小型化、结构简单化及多频或宽带。高介电常数基板可以缩小微波辐射波长，达到天线小型化的目的。采用活性酯作为环氧树脂的固化剂，活性酯固化剂分子中有两个或多个具有较高活性的酯基，可以同环氧树脂进行固化反应。在同环氧树脂反应时形成不含仲醇羟基的网架，所以固化后的环氧树脂具有低的介电损耗和吸水率。采用高介电常数填料作为功能填料。研制的高介电常数覆铜板具有低的热膨胀系数、低的介电损耗和低的吸水率。

Study on high dielectric constant copper clad laminate based on active ester curing agent and epoxy resin

Current antenna design is focusing on miniaturization, structure simplification, and multi-band or broadband. The high dielectric constant substrate can be used to shorten a wavelength of the microwave radiation, so as to miniaturize the antenna size. Active ester is used as curing agents for epoxy resin. The active ester curing agent refers to one having two or more active ester groups in one molecule with high reactivity and having an action to cure the epoxy resin. A network is formed without producing secondary hydroxyl groups by the reaction with epoxy resin. So tile cured epoxy resin has better dielectric properties and lower moisture absorption rate. The high dielectric constant filler is used as functional filler. The resulting high dielectric constant copper clad laminate has a low coefficient of thermal expansion, a low dielectric loss tangent and a low moisture absorption rate.