| 浅析PCB两种重要可靠性测试方法 |
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| 引用本文： | 黄世清,张利华. 浅析PCB两种重要可靠性测试方法[J]. 印制电路信息, 2014, 0(4): 88-94 |
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| 作者姓名： | 黄世清 张利华 |
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| 作者单位： | 深南电路有限公司,广东深圳518053 |
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| 摘 要： | 电路板可靠性评估是每个制造厂家、客户研究得最多的课题，互联应力测试及冷热循环测试是现有的在短时间内评估电路板的长期可靠性的有效测试方法。文章对互联应力测试及冷热循环测试方法及标准进行了详细介绍，并通过简单的实际测试研究案例来介绍如何分析失效并找出失效原因，并提出一些失效原因的改善方向。
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| 关 键 词： | 可靠性 互联应力测试 冷热循环测试 |
Study of two important PCB reliability test methods |
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| HUANG Shi-qing,ZHANG Li-hua. Study of two important PCB reliability test methods[J]. Printed Circuit Information, 2014, 0(4): 88-94 |
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| Authors: | HUANG Shi-qing ZHANG Li-hua |
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| Affiliation: | HUANG Shi-qing, ZHANG Li-hua |
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| Abstract: | PCB reliability testing is the most frequent subject the manufacturers and costumers devoted into. Intercenect stress test（IST）and thermal cycle test（TCT）are two of the most polular and effective test methods for evaluating the reliability of PCB in long term application within shot testing time. This paper introduce the test method and standard of IST and TCT, and presentate how to analysis test failures by introducing some study cases the auther have devoted into, and also recommend some improve dicection for IST and TCT failures. |
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| Keywords: | Reliability IST TCT |
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