| 高频高密度互连刚挠结合板制作技术介绍 |
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| 引用本文： | 何淼,朱拓,田晴,覃红秀,钟浩文. 高频高密度互连刚挠结合板制作技术介绍[J]. 印制电路信息, 2014, 0(3): 30-33,49 |
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| 作者姓名： | 何淼 朱拓 田晴 覃红秀 钟浩文 |
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| 作者单位： | 深圳崇达多层线路板有限公司,广东 深圳518132 |
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| 摘 要： | 结合当今的电子产品发展方向,探索出一款12层,集合3阶HDI、高频板材、刚挠结合三种特性于一身的印制板的制作技术难点,并就问题点提出改善方法。
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| 关 键 词： | 高密度互连 高频 刚挠结合板 |
High frequency,high density interconnect rigid-lfex PCB production technology |
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| HE Miao,ZHU Tuo,TIAN Qing,QIN Hong-xiu,ZHONG Hao-wen. High frequency,high density interconnect rigid-lfex PCB production technology[J]. Printed Circuit Information, 2014, 0(3): 30-33,49 |
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| Authors: | HE Miao ZHU Tuo TIAN Qing QIN Hong-xiu ZHONG Hao-wen |
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| Affiliation: | HE Miao, ZHU Tuo, TIAN Qing, QIN Hong-xiu, ZHONG Hao-wen |
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| Abstract: | Considering the development of electronic products, this paper explored the PCB production technical dififculties of a 12 layer, with three kinds of characteristics 3＋N＋3 structure of HDI, high frequency, rigid-Flex, and the improvement method of problem is proposed. |
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| Keywords: | HDI High Frequency Rigid-Flex PCB |
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