一种制造印制电路板的加成法新工艺简

研发了一种制备印制电路板（PCB）的印刷、吸附、催化加成法工艺。该工艺结合了印刷技术与化学镀技术，通过印刷离子吸附油墨形成线路图形、吸附催化离子、化学镀铜使线路金属化等工艺，可以低污染、无浪费的制备电性能和粘附力均优良的导电线路，基板选择范围广，可以直接制备单面和双面PCB，故是一种有应用前景的制备PCB的少减法新技术。

A new kind of additive process for fabricating Printed Circuit Board

An additive process, named patterning-adsorption-plating, to fabricate printed circuit board （PCB） was developed. The developed process combines printing with electroless plating and involves several processing steps such as printing of ion-adsorption ink, adsorption of catalytic ion and metallization of patterns by electroless plating. This allows to obtain high conductive, adhesive patterns of double-sided PCB with lower pollution to environment and no waste of material. It is so considered as a new additive process to fabricate PCB with high potential application.