| 任意层HDI对位系统研究 |
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| 引用本文： | 孟应许,周尚松,吴六雄,李再. 任意层HDI对位系统研究[J]. 印制电路信息, 2014, 0(4): 190-196 |
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| 作者姓名： | 孟应许 周尚松 吴六雄 李再 |
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| 作者单位： | 深南电路有限公司,广东深圳518117 |
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| 摘 要： | 随着电子产业的发展，任意层互联HDI板在高端消费品领域得到了越来越多的应用，其盲孔阶数已经从最初的3阶发展到现在的5阶以上，最高甚至出现了7阶的HDI板。文章通过对不同的对位系统进行研究，分析不同对位系统的关键点及差异，为业界加工同类型产品提供必要的参考。
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| 关 键 词： | HDI 多阶 对位系统 对位精度 |
Research on alignment system of anylayer HDI |
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| MENG Ying-xu,ZHOU Shang-song,WU Liu-xiong,LI Zai. Research on alignment system of anylayer HDI[J]. Printed Circuit Information, 2014, 0(4): 190-196 |
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| Authors: | MENG Ying-xu ZHOU Shang-song WU Liu-xiong LI Zai |
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| Affiliation: | MENG Ying-xu, ZHOU Shang-song, WU Liu-xiong, LI Zai |
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| Abstract: | With the development of electronic industry, anylayer HDI boards has been used more and more in the ifeld of high-end consumer goods. The blind via has developed from 3 to 5, and the highest step even reached 7. Based on the research of the different alignment systems, this paper analyzes the key points and difference of each alignment system, and provides necessary reference for the industry. |
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| Keywords: | HDI Multi Steps Alignment System Alignment Accuracy |
| 本文献已被 CNKI 维普 等数据库收录！ |
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