| 高Tg半挠性覆铜板的研究开发 |
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| 引用本文： | 汪青,刘东亮.高Tg半挠性覆铜板的研究开发[J].印制电路信息,2014(3):17-19. |
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| 作者姓名： | 汪青 刘东亮 |
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| 作者单位： | 广东生益科技股份有限公司,广东 东莞523039 |
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| 摘 要： | 文章介绍了半挠性覆铜板的应用，并研究了各种增韧剂对覆铜板配方挠曲性能的影响，在综合各种增韧剂的性能基础上开发出了高Tg半挠性覆铜板配方，可应用于刚挠结合板等领域。
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| 关 键 词： | 刚挠结合板 增韧剂 挠曲性 |
Study on high Tg and semi-lfexible CCL |
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| WANG Qing,LIU Dong-liang.Study on high Tg and semi-lfexible CCL[J].Printed Circuit Information,2014(3):17-19. |
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| Authors: | WANG Qing LIU Dong-liang |
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| Affiliation: | WANG Qing, LIU Dong-liang |
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| Abstract: | The application of semi-flexible CCL was introduced in the article, and the influence of toughening agent on lfexibility of CCL was researched. High Tg and semi-lfexible CCL formula was developed under comprehensive research of many kinds of toughening agents, the formula can be used in rigid-lfexible printed circuit board. |
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| Keywords: | R-FPCB Toughening Agent Flexibility |
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