一种超厚铜板制作工艺探讨

通常铜厚≥350mm（10 oz）以上电路板称为超厚铜板，其主要应用于大电流大功率电源、清洁能源太阳能等产品。随着这类产品需求量的迅速增长，未来超厚铜板必然会成为PCB发展的另一趋势之一。超厚铜板由于铜厚较厚，制作时内层无铜区填胶、钻孔、蚀刻等工序都存在一定的难度。文章通过制开发28 oz的超厚铜板，对选用的材料及制作工艺等方面进行优化，解决了这类板制作过程中蚀刻、压合、钻孔等工序的制作难点，为业内同行制作此类超厚铜板提供参考。

Discussion on production process of ultra thick copper PCB

Ultra thick copper board, which copper thickness is more than or equal to 350μm,and is mainly used in high current power supply, clean energy products. With the rapid growth demand of this kind of product, Ultra thick copper will become one trend of PCB development in future. For heavy copper, there are some dififculties in iflling the inner copper free area, drilling, etching processes. This paper, we producted a 980μm（28oz）ultra thick copper board and finally solved the fabrication difficulties in etching, lamination and drilling process through the method of optimizing the selection of materials and production process, provide a reference for industry peer processing this kind of ultra thick copper board.