| PCB焊点焊接缺陷原因分析 |
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| 引用本文： | 陈强,王一雄. PCB焊点焊接缺陷原因分析[J]. 印制电路信息, 2014, 0(3): 67-70 |
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| 作者姓名： | 陈强 王一雄 |
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| 作者单位： | 深圳市迅捷兴电路技术有限公司,广东 深圳518054 |
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| 摘 要： | PCB焊点焊接缺陷产生的原因可能很多，如果你从扩散焊接的特点考虑就会变得明了起来！熔化的焊料原子沿着被焊接金属的结晶晶界的扩散，扩散所需要的激活能也可称为“表面自由能”比体扩散小。一般锡料的活性能约为380达因/厘米，鲜活的铜面在助焊剂的辅助下约为1265达因/厘米，所以焊接可以良好进行。
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| 关 键 词： | 合金共化物 表面自由能 镍层腐蚀 共晶锡 硫化银膜 |
PCB solder welding defect cause analysis |
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| CHEN Qiang,WANG Yi-xiong. PCB solder welding defect cause analysis[J]. Printed Circuit Information, 2014, 0(3): 67-70 |
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| Authors: | CHEN Qiang WANG Yi-xiong |
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| Affiliation: | CHEN Qiang, WANG Yi-xiong |
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| Abstract: | There may be a lot causes of PCB solder welding defects. However if you consider from the characteristics of diffusion welding, it will become clear! The crystallization of molten solder atoms spreads along the weld metal grain boundary diffusion. The spreading needed to activate can also be referred to as the Surface Free Energy than the body of the diffusion. The activity of general tin material can be approximately 380 dyne/cm, and lively copper surface under the auxiliary of lfux is about 1265 dyne/cm, so welding can be performed well. |
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| Keywords: | Alloy Compound Surface Free Energy. Nickel Layer Corrosion Eutectic Solder Silver Sulifde Film |
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