| BGA密集孔耐热性能影响因素分析 |
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| 引用本文： | 吴云鹏.BGA密集孔耐热性能影响因素分析[J].印制电路信息,2014(4):107-110. |
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| 作者姓名： | 吴云鹏 |
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| 作者单位： | 天津普林电路股份有限公司,天津300308 |
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| 摘 要： | 文章以球栅阵列（BGA）密集孔耐热性能影响因素进行分析，考虑多层压合、机械钻孔、湿处理等工艺流程参数对耐热性能的影响，通过DOE方式，确定各制程对耐热性的影响程度，优化加工参数，改善BGA孔耐热性能。
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| 关 键 词： | 多层压合 机械钻孔 棕化 烘烤 |
The analysis of the factors affecting heat resistance of dense holes at BGA area |
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| WU Yun-peng.The analysis of the factors affecting heat resistance of dense holes at BGA area[J].Printed Circuit Information,2014(4):107-110. |
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| Authors: | WU Yun-peng |
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| Affiliation: | WU Yun-peng |
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| Abstract: | This article analyzes the factors affecting heat resistance of dense holes at BGA area. Considering the process parameters of multi laminating, mechanical drilling and wet processing etc, apply DOE method to conifrm their inlfuence degree on heat resistance , optimize process parameters and improve hole＆#39;s heat resistance at BGA area. |
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| Keywords: | Multi Laminating Mechanical Drilling Brown Oxide Baking |
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