电镀金刚石线锯使用性能的试验研究

为评价电镀金刚石线锯的使用性能，搭建恒力进给式金刚石线锯性能评价试验机，对编号为Ⅰ、Ⅱ的2种基体直径相同的电镀金刚石线锯进行单晶硅切片试验，记录切片时间，计算锯切效率，利用粗糙度仪、光学显微镜、扫描电子显微镜分别测量硅片表面粗糙度、锯缝宽度及锯丝表面磨粒脱落率。试验结果表明:金刚石线锯性能评价试验机能够定量评价电镀金刚石线锯的使用性能；Ⅰ号线锯的锯切效率比Ⅱ号线锯的高13.6%；用Ⅱ号线锯切片得到的硅片走丝方向、进给方向的表面粗糙度分别比用Ⅰ号线锯的小17.5%、10.8%；Ⅰ号线锯的锯缝宽度比Ⅱ号线锯的小3.8%；Ⅱ号线锯的使用寿命比Ⅰ号线锯的长；Ⅰ号线锯的磨粒脱落率是Ⅱ号线锯的2.1倍。 

Experimental analysis on application performance of electroplated diamond wire saw

The unique test device with constant force feed is set up to evaluate the application performance of diamond wire saws, and the experiment of cutting single crystal silicon is carried out with two different electroplated diamond wire saws Ⅰ and Ⅱ. In the experiment, the surface roughness, kerf width and abrasive shedding rate are observed and measured with related instruments, and the sawing efficiency is calculated by recording machining time. The results show that the performance of diamond wire saw could be evaluated by the test device, quantitatively. It is also found that the sawing efficiency of wire saw Ⅰ is 13.6% higher than that of wire saw Ⅱ. In addition, the surface roughness of wafer sliced in feeding direction and movement direction by wire saw Ⅱ is 17.5% and 10.8% smaller than that of wafer sliced by wire saw Ⅰ. The kerf width of wire saw Ⅰ is 3.8% lower than that of wire saw Ⅱ. Finally, the service life of wire saw Ⅱ is longer than that of wire saw Ⅰ. The abrasive shedding rate of wire saw Ⅰ is 2.1 times that of wire saw Ⅱ.