Stress states in plasma-sprayed thermal barrier coatings upon temperature cycling: Combined effects of creep,plastic deformation,and TGO growth

To ascertain material parameter effects on the stress states is beneficial to comprehend the crack growth behavior and delamination mechanism in thermal barrier coatings (TBCs). In this work, numerical models are established to explore the combined effects of material parameters including creep, plastic deformation, and thermally grown oxide (TGO) growth on the stress states upon temperature cycling. For all layers, thermal-physical properties reliant on temperature are incorporated into the model. The process of bond coat (BC) oxidation, namely TGO growth, is materialized by changing material properties with cycles. Based on the principle of a single variable, the residual stress states are explored using many different material combinations. The results indicate that the tensile stress in the ceramic top coat (TC) decreases with the increase in the TGO lateral strain distribution gradient. Increasing the BC yield strength or decreasing the TGO growth stress can reduce the tensile stress in TC if there is no creep in the model. When BC yield strength is relatively high (≥150 MPa), BC creep will strengthen the TC tensile stress. TGO creep can decrease the tensile stress in TC irrespective of TGO growth stress and BC creep. When TGO creep rate is higher than 10B^tgo, an exceedingly small tensile stress can always be achieved. This work could provide significant theory direction for material selection and composition control towards advanced TBCs with prolonged lifetime.