| Abstract: | Thermally conductive composites and nanocomposites composed of epoxy resin as base matrix and aluminum nitride (AlN) as micro and nanofiller have been studied at variable temperatures and loading of AlN. To improve the dispersion of the filler within the polymer matrix, AlN was surface modified with silane‐coupling agent. Thermogravimetric analysis confirmed the interfacial bonding of epoxy‐ and silane‐modified AlN. The dielectric properties of epoxy/AlN composites and nanocomposites have been studied at variable percentage of filler. Test result indicated an increase of thermal conductivity of the composites at 20 wt% of AlN. Also, silane‐treated composites exhibited improved electrical conductivity properties, whereas the electrical insulation property decreased in terms of dielectric strength and resistivity. POLYM. COMPOS., 2013. © 2012 Society of Plastics Engineers |
