Structural and electrical properties of low resistance Pt/Pd/Au contact on p-GaN

We have investigated electrical and structural properties of Pt/Pd/Au ohmic contact on p-type GaN:Mg (2.5 × 10¹⁷ cm⁻³) using Auger electron spectroscopy (AES) and glancing angle x-ray diffraction (GXRD) analysis. It was shown that the specific contact resistivity improved with increasing annealing temperature. The annealing of the contact at 600^∘C for 2 min in flowing N₂ atmosphere resulted in a specific contact resistivity of 3.1 × 10⁻⁵ Ω cm². Both GXRD and AES depth profile results show that Ga₃Pt₅, Ga₂Pd₅, and Au₇Ga₂ phases are formed at the interface region between metal and GaN when annealed at temperatures 600^∘C. Possible explanation is suggested to describe the annealing dependence of the specific contact resistivity of the Pt/Pd/Au contacts.