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Directed 2D-to-3D pattern transfer method for controlled fabrication of topologically complex 3D features in silicon
Authors:Rykaczewski Konrad  Hildreth Owen J  Wong Ching P  Fedorov Andrei G  Scott John Henry J
Affiliation:Material Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899-8370, USA. konrad.rykaczewski@nist.gov
Abstract:A process that allows control over the 3D motion of catalyst nanostructures during metal-assisted chemical etching by their local pinning prior to etching is demonstrated. The pinning material acts as a fulcrum for rotation of the catalyst structures resulting in etching of silicon features with rotational geometry.
Keywords:Nanostructures  Patterning  3D Fabrication  Focussed Ion Beam  Electron Beam Induced Deposition  Metal‐Assisted Chemical Etching
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