| 焊点疲劳寿命的量化评价方法及其影响因素 |
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| 引用本文： | 孙晓君,胡冬,谢劲松,周岭,王晓明.焊点疲劳寿命的量化评价方法及其影响因素[J].电子元件与材料,2010,29(11). |
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| 作者姓名： | 孙晓君 胡冬 谢劲松 周岭 王晓明 |
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| 作者单位： | 北京航空航天大学可靠性与系统工程学院;中国航天科技集团中国空间技术研究院; |
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| 摘 要： | 焊点蠕变疲劳是电子产品破坏中一种最主要的形式,对焊点疲劳寿命的量化评价是电子产品可靠性分析中的关键环节。总结了IPC标准中的焊点蠕变疲劳模型,然后利用实例说明了如何在实际使用中对焊点寿命进行分析和预计,最后重点讨论了模型中的6个相关参数对焊点疲劳寿命及参数设计优化所带来的影响。分析表明,当有、无引脚器件的焊点间距分别大于1.143 0与0.063 5 cm时,器件的疲劳寿命均随引脚间距变大而急剧减小;此外,热失配仍然是影响焊点疲劳寿命的主要因素。
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| 关 键 词： | 焊点 疲劳模型 寿命预计 量化评价 影响因素 |
Quantitative method evaluating the fatigue life of solder joint and some factors influencing the evaluation |
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| SUN Xiaojun,HU Dong,XIE Jinsong,ZHOU Ling,WANG Xiaoming.Quantitative method evaluating the fatigue life of solder joint and some factors influencing the evaluation[J].Electronic Components & Materials,2010,29(11). |
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| Authors: | SUN Xiaojun HU Dong XIE Jinsong ZHOU Ling WANG Xiaoming |
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| Affiliation: | SUN Xiaojun1,HU Dong1,XIE Jinsong1,ZHOU Ling2,WANG Xiaoming2(1.School of Reliability and Systems Engineering,Beijing University of Aeronautics and Astronautics,Beijing 100191,China,2.China Academy of Space Technology,China Aerospace Science and Technology Group,Beijing 100080,China) |
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| Abstract: | Creep fatigue of solder joint is one of the most important reasons for the failure of electronics products,and evaluating the fatigue life of solder joint quantitatively is necessary for the reliability analysis of electronics products.First the creep-fatigue models for solder joint described in the IPC standards was summarized,then how to use these models to analyze and predict the life of solder joint in real cases using an example was showed,and finally the effects of 6 key parameters on the fatigue life... |
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| Keywords: | solder joint fatigue model life prediction quantitative evaluation influencing factor |
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