| 半导体封装快速养护炉炉温分布的计算机仿真 |
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| 引用本文： | 付俊庆.半导体封装快速养护炉炉温分布的计算机仿真[J].工业加热,2003,32(4):14-17. |
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| 作者姓名： | 付俊庆 |
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| 作者单位： | 长沙交通学院,汽车与机电工程系,湖南,长沙,410076 |
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| 基金项目： | 香港城市大学基金资助项目(7000874) |
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| 摘 要： | 半导体封装快速养护炉是半导体封装过程中的一个关键设备。半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。通过对某养护炉炉内温度场的计算机仿真分析发现，现有养护炉在设计上存在缺陷，通过加长养护炉的方法，可以改善养护炉内温度场的分布，满足半导体封装粘结工艺养护的要求。
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| 关 键 词： | 计算机仿真 半导体封装 养护炉 温度场 |
| 文章编号： | 1002-1639(2003)04-0014-04 |
| 修稿时间： | 2003年3月12日 |
Computer Simulation of Temperature Field of A Snap Curing Oven for the Semiconductor Packaging |
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| FU Jun-qing.Computer Simulation of Temperature Field of A Snap Curing Oven for the Semiconductor Packaging[J].Industrial Heating,2003,32(4):14-17. |
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| Authors: | FU Jun-qing |
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| Abstract: | The snap curing oven is key equipment in the semiconductor packaging. The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement. Through simulating the temperature field of the curing oven, the paper found that the design of the oven has some defects, and that the lengthening oven can bring out the temperature field of curing oven to be even, such the requirements of die bonding can be satisfied. |
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| Keywords: | computer simulation simulation semiconductor packaging curing oven temperature field |
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