硫酸双氧水型超粗化剂BTH-2066的开发及在精细线路图形制作中的应用

介绍了新一代H2SO4/H2O2体系超粗化剂BTH-2066的工作原理、工艺及其在精细线路图形制作中的应用。BTH-2066超粗化处理过的铜表面成均匀的蜂窝状,显著地增大了铜箔表面积,为干膜、湿膜有着良好的粘合力提供了强有力保证。传统的H2SO4/H2O2体系化学清洗只对铜面有初步的清洁作用,铜面呈现半光亮或光亮状,铜面微观粗糙度低,对于3mil/3mil及以下的精细线路,很容易因粘附力不足而产生线路图形的缺陷,影响做板良率。BTH-2066超粗化具有稳定可控的微蚀速率,极佳的超粗化微蚀面,彻底地解决了铜面与干膜、湿膜之间机械粘合力的问题,可降低线路不良比率,增加细线路制作能力。BTH-2066超粗化是高精密线路制作化学前处理的首选工艺。

Development of Sulfuric Acid/Hydrogen Peroxide System Roughening Reagent BTH-2066 and Application to Manufacture Fine-Line Circuit Pattern

to manufacture fine line circuit pattern such as 3/3 rail or below it, a good adhesion between copper and dry/wet film can＇t be achieved, which results in many production faults and has an important effect on the first pass rate. BTH-2066 has many advantages such as stable and easy control microetch rate, excellent roughened copper surface, which effectively improves adhesion between copper and dry/wet film and decreases the fault rate. So this process is specially adapt to the pretreatment for high fine line circuit manufacture.