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High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages |
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| Authors: | Surendar A Adi Siswanto Waluyo Alijani Maryam Alhaifi K Salmani Mohammad |
| Affiliation: | 1.Department of Electronics and Communication, Vignan’s Foundation for Science Technology and Research, Guntur, India ;2.Faculty of Engineering, Universitas Muhammadiyah Surakarta, Surakarta, Indonesia ;3.Department of Physics, University of Zanjan, Zanjan, Iran ;4.Department of Automotive and Marine Engineering, College of Technological Studies-PAAET, Kuwait city, Kuwait ;5.Payameh Noor University, Tehran branch, Tehran, Iran ; |
| Abstract: | Microsystem Technologies - The purpose of this work is to show the effects of drop impact on the creep-fatigue evolution of solder balls in an electronic device. Finite element method analysis was... |
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