Pb-free surface-finishing on electronic components’ terminals for Pb-free soldering assembly |
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Authors: | Hitoshi Tanaka Morimasa Tanimoto Akira Matsuda Takeo Uno Masaaki Kurihara Shoji Shiga |
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Affiliation: | (1) Metal Research Center, R&D Div., Furukawa Electric Co., Ltd., 500 Kiyotaki, 321-0942 Nikko, Japan |
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Abstract: | Pb-free solderable surface finishing is essential to implement Pb-free solder assembly in order to meet with the growing demand
of environmental consciousness to eliminate Pb from electronic products. Two types of widely applicable Pb-free surface finishing
technologies are developed. One is the multilayer-system including Pd with Ni undercoat. Heat-resistance of Pd enables whole-surface-plating
on to leadframe before IC-assembling process. The other is the double-layer-system with low-melting-point-materials, for example,
thicker Sn underlayer and thinner Sn-Bi alloy overlayer, dilutes Sn-Bi alloy’s defects of harmful reactivity along with substrate
metal and mechanical brittleness with keeping its advantages of solder-wettability and no whisker. |
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Keywords: | Pb-free surface-finishing Sn-Bi with Sn undercoat Pd with Ni undercoat |
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