| 管式炉中半导体激光器巴条封装 |
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| 引用本文： | 张秋月,井红旗,袁庆贺,马骁宇,董连和. 管式炉中半导体激光器巴条封装[J]. 激光与光电子学进展, 2019, 56(9): 162-166 |
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| 作者姓名： | 张秋月 井红旗 袁庆贺 马骁宇 董连和 |
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| 作者单位： | 长春理工大学光电工程学院,吉林长春,130022;中国科学院半导体研究所光电子器件国家工程中心,北京,100083 |
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| 摘 要： | 采用808nm大功率半导体激光器巴条进行了封装实验,对影响封装质量的两个重要因素,即管炉温度和烧结时间进行了优化。结果表明,在管炉温度为650℃、烧结时间为100s时,焊料层界面空洞最少,半导体激光器巴条的smile效应值最低,阈值电流最小,波长更加稳定,烧结质量最优。
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| 关 键 词： | 激光器 半导体激光器 封装 烧结 smile效应 |
Packaging of Semiconductor Laser Bars in Tube Furnace |
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| Zhang Qiuyue,Jing Hongqi,Yuan Qinghe,Ma Xiaoyu,Dong Lianhe. Packaging of Semiconductor Laser Bars in Tube Furnace[J]. Laser & Optoelectronics Progress, 2019, 56(9): 162-166 |
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| Authors: | Zhang Qiuyue Jing Hongqi Yuan Qinghe Ma Xiaoyu Dong Lianhe |
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| Affiliation: | (Institute of Opto-Electronics Engineer, Changchun University of Science and Technology,Changchun , Jilin 130022, China;National Engineering Research Center for Optoelectronic Devices, Institute of Sem iconductors,Chinese Academy of Sciences, Beijing 100083, China) |
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| Abstract: | Zhang Qiuyue;Jing Hongqi;Yuan Qinghe;Ma Xiaoyu;Dong Lianhe(Institute of Opto-Electronics Engineer, Changchun University of Science and Technology,Changchun , Jilin 130022, China;National Engineering Research Center for Optoelectronic Devices, Institute of Sem iconductors,Chinese Academy of Sciences, Beijing 100083, China) |
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| Keywords: | lasers semiconductor laser packaging soldering smile effect |
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