| LTCC多层微波传输线的性能优化研究 |
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| 引用本文： | 姜伟卓,符鹏,王锋. LTCC多层微波传输线的性能优化研究[J]. 电子机械工程, 2006, 22(6): 45-48 |
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| 作者姓名： | 姜伟卓 符鹏 王锋 |
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| 作者单位： | 南京电子技术研究所,江苏,南京,210013 |
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| 摘 要： | 采用LTCC技术制造的多层基板是高密度微波多芯片组件的关键部件，其多层微波传输线的性能将直接影响组件的性能。对LTCC多层基板中微带线、带状线及其互连过渡结构的性能进行了仿真，通过优化接地通孔的设置，有效地抑制了谐振，扩展了应用的频率范围。
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| 关 键 词： | 多层微带线 多层带状线 互连过渡 |
| 文章编号： | 1008-5300(2006)06-0045-04 |
| 收稿时间： | 2006-06-07 |
| 修稿时间： | 2006-06-07 |
Optimization of Performances of Microwave Transmission Lines on LTCC Multilayer Substrate |
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| JIANG Wei-zhuo,FU Peng and WANG Feng. Optimization of Performances of Microwave Transmission Lines on LTCC Multilayer Substrate[J]. Electro-Mechanical Engineering, 2006, 22(6): 45-48 |
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| Authors: | JIANG Wei-zhuo FU Peng WANG Feng |
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| Affiliation: | Nanjing Research Institute of Electronics Technology, Nanjing 210013, China |
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| Abstract: | LTCC multilayer substrate is the key element of high-density MMCM(microwave multi-chip module).The performance of the module is significantly influenced by multilayer microwave transmission line.The microstripline,stripline and the transition between them are simulated and optimized by changing the setting of grounding vias.The resonance is decreased effectively and the frequency band is widened. |
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| Keywords: | LTCC |
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