|
|||||
|
|
Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs) |
|
| Authors: | Ho-Young Son Chang-Kyu Chung Myung-Jin Yim Jin-Sang Hwang Kyung-Wook Paik Gi-Jo Jung Jun-Kyu Lee |
| Affiliation: | Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon; |
| Abstract: | |
| Keywords: | |