| C194铜合金的强化机制概述 |
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| 引用本文： | 刘凯,柳瑞清,谢春晓. C194铜合金的强化机制概述[J]. 热处理, 2007, 22(1): 24-29 |
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| 作者姓名： | 刘凯 柳瑞清 谢春晓 |
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| 作者单位： | 江西理工大学材料与化学工程学院,江西,赣州,341000;江西理工大学材料与化学工程学院,江西,赣州,341000;江西理工大学材料与化学工程学院,江西,赣州,341000 |
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| 摘 要： | 引线框架是集成电路中的一个关键组成部分，近年来，引线框架材料得到了极大的发展。论述了引线框架铜含金的设计思路，介绍了不同高强高导铜含金的强化机制和导电原理，并分析了C194铜金含金的强化机制。
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| 关 键 词： | 引线框架 C194铜合金 合金化法’导电原理 强化机制 |
| 文章编号： | 1008-1690(2007)01-0024-006 |
| 修稿时间： | 2006-10-20 |
Review on Strengthening Mechanism of C194 Copper Alloy |
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| LIU Kai,LIU Rui-qing,XIE Chun-xiao. Review on Strengthening Mechanism of C194 Copper Alloy[J]. Heat Treatment, 2007, 22(1): 24-29 |
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| Authors: | LIU Kai LIU Rui-qing XIE Chun-xiao |
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| Abstract: | The lead flame is a key component of integrated circuit.Materids used for the lead frame has been consi-derably developed in recent years.Various design concepts of copper alloys for the lead frame were reviewed,and the strengthening mechanism and the electric conduction principle of different high-strength and high-conductivity copper alloys introduced,with the strengthening mechanism of C194 copper alloy being analyzed. |
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| Keywords: | lead flame C194 copper alloy alloying electric conduction priciple strengthening mechanism. |
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