集成电路芯片上光互连研究的新进展

讨论了集成电路向高集成度、高工作频率和高传输速率继续发展时 ,常规金属互连出现的困难以及集成电路芯片上光互连具有的潜在优势 .介绍了组成芯片上光互连的光发射器件、光接收器件和光传输器件等三种基本器件及其与硅集成电路集成的研究新进展 .最后展望了集成电路芯片上光互连的应用前景 .

The Recent Progress of On-Chip Optical Interconnects for Integrated Circuits

The limitations of conventional metallization interconnects of integrated circuits and the potential solution of the on chip optical interconnect are discussed.The recent progress of the three basic optical interconnect devices (light emitter,photo receiver and optical waveguide) and their integration with silicon ICs are overviewed and reviewed.Finally,the prospect of on chip optical interconnects on integrated circuits is appraised.