| 溅射条件对SiO2膜力学特性的影响 |
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| 引用本文： | 孙承松,魏永广,关艳霞. 溅射条件对SiO2膜力学特性的影响[J]. 沈阳工业大学学报, 1999, 21(3): 204-206 |
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| 作者姓名： | 孙承松 魏永广 关艳霞 |
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| 作者单位： | 沈阳工业大学信息科学与工程学院,辽宁,沈阳110023 |
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| 摘 要： | 介绍了在不锈钢衬底和Ｎｉ－Ｃｒ应变电阻间ＳｉＯ２薄膜的制做方法，在不宜用热氧化和ＣＶＤ法制做ＳｉＯ２膜的情况下，利用该法是行之有效的．探讨了溅射工艺条件对膜附着力和应力的影响，并指出了制备具有较好附着力和较低应力的方法．
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| 关 键 词： | 溅射 SiO_2膜 力学特性 |
| 修稿时间： | 1998-12-13 |
Effect of sputtering conditions on dynamic property of SiO2 thin film |
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| SUN Cheng-song,WEI Yong-guang,GUAN Yan-xia. Effect of sputtering conditions on dynamic property of SiO2 thin film[J]. Journal of Shenyang University of Technology, 1999, 21(3): 204-206 |
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| Authors: | SUN Cheng-song WEI Yong-guang GUAN Yan-xia |
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| Abstract: | This paper introduce the fabrication of SiO2 thin film between the stainless steel substrateand Ni - Cr strain resistance, annlyses the effect of sputtering conditions on the thin film adhe-and proposes the way to make the thin film with good adhesion and the strain sion and little strainThe method is a very effective on the condition that the ways of heat oxidation and CVD are notappropriate during the fabrication of SiO2 film. |
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| Keywords: | sputtering SiO2 thin film dynamic property |
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