基于ANSYS/LS-DYNA的单颗粒金刚石切割氧化铝陶瓷表面温度场研究

对单颗粒金刚石切割氧化铝陶瓷过程中切削热、表面粗糙度、应变进行研究,通过利用ANSYS/LS-DYNA对切削过程进行3D模拟,热力耦合,分析在不同走丝速度条件下,工件表面裂纹和形貌情况;将切削温度场拟合进切削过程,研究切削热分布以及切削过程中应变问题。仿真结果显示,切削热基本维持在60℃左右,且温度传导较慢,范围较小;工件在切削过程中与磨粒底部接触的裂纹深于两侧,且受走丝速度影响较小;脆性材料切削主要以弹性应变为主。

To study surface temperature field of cutting alumina ceramic with single diamond grain based on the ANSYS/LS-DYNA

The paper aims to study the cutting heat, surface appearance, strain of the process of cutting alumina ceramic cutting with single diamond grain. By using ANSYS / LS-DYNA to simulate the 3D process of cutting alumina ceramic cutting with single diamond grain, and set up the Thermal-mechanical Coupling model. Then, at the speeds moving wire, the tool stress and the situations of work-piece surface cracks and topography is investigated. The temperature field, and strain distribution are investigated after thermal-mechanical coupling method is considered. Simulation results show that the cutting heat basically maintained at about 60 ℃, it conduces and ranges little. The crack of work-piece contact with abrasive＇ bottom is deeper than both sides, and crack was less affected by moving wire speed. Cutting brittle materials based mainly on the elastic strain.