| 溅射环境下薄膜沉积速率的影响因素 |
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| 引用本文： | 田跃生. 溅射环境下薄膜沉积速率的影响因素[J]. 纳米科技, 2011, 0(5): 78-81 |
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| 作者姓名： | 田跃生 |
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| 作者单位： | 宁夏职业技术学院,宁夏银川750002 |
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| 摘 要： | 基于溅射沉积和薄膜生长原理，系统综述分析电场环境、气氛环境和工件空间位置及旋转方式对薄膜沉积速率的客观影响规律，旨在为产业界和学术界生产、研发各种纳米薄膜提供经验支持与工艺指导。
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| 关 键 词： | 溅射环境 薄膜 沉积速率 |
Effecting Factor on Deposition Rate of Films in Sputtering Environment |
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| TIAN Yue-sheng. Effecting Factor on Deposition Rate of Films in Sputtering Environment[J]. , 2011, 0(5): 78-81 |
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| Authors: | TIAN Yue-sheng |
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| Affiliation: | TIAN Yue-sheng (Vocational and Technical College of Ningxia, Yinchuan 750002, China) |
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| Abstract: | Based on sputtering depositing principium and film growth principium, the impersonal effect of electric field environment, atmosphere environment, the spatial location of the workpiece and the rotation mode on the deposition rate of films was systematic analyzed. Expected to provide empirical support and technical guidance to the production industry and academia to research and develop kinds of nano-films. |
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| Keywords: | sputtering environment films deposition rate |
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