| 加速浸润方法在塑封可靠性分析中的应用 |
| |
| 引用本文： | 袁华,钱敏.加速浸润方法在塑封可靠性分析中的应用[J].电子与封装,2010,10(1):35-38,42. |
| |
| 作者姓名： | 袁华 钱敏 |
| |
| 作者单位： | 1. 飞索半导体中国有限公司,苏州,215000;苏州大学电子信息学院微电子系,苏州,215021
2. 苏州大学电子信息学院微电子系,苏州,215021 |
| |
| 摘 要： | 在对塑封集成电路进行封装可靠性评估中,预处理过程(precondition)是必经的步骤。其中的浸润测试(soak)通常在非加速条件下进行,其耗时较长。在市场竞争日趋激烈的环境下,企业迫切需要缩短新产品的可靠性验证时间。文章针对JEDEC(电子器件工程联合委员会)和JEITA(日本电子信息技术协会)标准中涉及到的三种加速浸润条件,以组件在非加速条件下(JEDEC Level 3和JEITA Rank E)潮气的穿透力、吸收量及由此产生的失效为参照,确定在加速条件下,组件达到同样的潮气吸收量并产生相类似的失效所需的时间。同时应用有限元分析的方法进行建模和计算,并与实际的测量结果比较验证。
|
| 关 键 词： | 可靠性 预处理 浸润 有限元分析 分层失效 |
Study on the Accelerated Soak Method in the Reliability Evaluation of Plastic Package |
| |
| YUAN Hua,QIAN Min.Study on the Accelerated Soak Method in the Reliability Evaluation of Plastic Package[J].Electronics & Packaging,2010,10(1):35-38,42. |
| |
| Authors: | YUAN Hua QIAN Min |
| |
| Affiliation: | 1.Spansion Co.Ltd;Suzhou 215000;China;2.Microelectronics Department;Suzhou University;Suzhou 215021;China |
| |
| Abstract: | In the semiconductor industry,during the component level reliability evaluation,the soak testing in the precondition is normally proceeded under non-accelerated which takes long time.In order to reduce the soak time,three accelerated soak conditions are studied with the reference of non-accelerated soak condition(JEDEC Level 3 and JEITA Rank E).Under the three accelerated soak conditions,the moisture gain and moisture distribution study are carried and confirmed by FEA(Finite Element Analysis).Also,the fail... |
| |
| Keywords: | reliability precondition soak finite element analysis(FEA) delamination |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
