Analysis of heat transfer of loop heat pipe used to cool high power LED

A novel loop heat pipe (LHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of the loop heat pipe under different heat loads and incline angles have been investigated experimentally. The obtained results indicate that the thermal resistance of the heat pipe heat sink is in the range of 0.19–3.1 K/W, the temperature uniformity in the evaporator is controlled within 1.5°C, and the junction temperature of high power LED can be controlled steadily under 100°C for a heat load of 100 W.