TRIZ理论在半导体激光器耦合封装中的应用

目的解决在同轴型半导体激光器与光纤耦合封装过程中,由于隔离器的引入造成的耦合速度慢、生产率低,以及隔离器与激光器的封装设备中电磁铁拾放隔离器的机构在拾取隔离器后难以释放等问题。方法应用TRIZ理论矛盾矩阵解决发明问题中技术冲突的方法,提出将隔离器与激光器预先封装在一起再与光纤耦合的工艺流程。结果设计出了全新的拾放机构,优化后的实验样机将1个带隔离器的同轴型半导体激光器与光纤的耦合封装时间由原来的2 min缩短到了40 s。结论新的工艺流程大大降低了整个器件封装的难度,提高了耦合效率。

Application of TRIZ Theory in Coupling and Packaging of Semiconductor Laser

The work aims to solve the slow coupling speed and low productivity caused by the introduction of isolator in the process of coupling and packaging of coaxial semiconductor laser and optical fiber, and to solve the problem that the mechanism of electromagnet cannot release the isolator after picking up in the packaging equipment for the isolator and the laser. The technical conflicts were solved in the method of TRIZ contradiction matrix. A technological process that the isolator and laser were encapsulated first and then coupled with the optical fiber was proposed. A brand new pick-and-place mechanism was designed. The optimized experimental prototype reduced the coupling time of the coaxial semiconductor laser with isolator and the optical fiber from 2 min in the original process to 40 s. The new technological process has greatly reduced the difficulty in packaging the entire device and improved the coupling efficiency.