Reduction of intermetallic compounds in ultrasonic-assisted semi-solid brazing of Al/Mg alloys |
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| Authors: | Zhiwu Xu Lei Xu Jiuchun Yan |
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| Affiliation: | 1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, People’s Republic of Chinaxuzw@hit.edu.cnxzwyhl@163.com;4. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, People’s Republic of China |
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| Abstract: | ABSTRACTAn ultrasonic-assisted semi-solid brazing method was used to control Mg/Al intermetallic compounds (IMCs). Zn–20.95Al, which has a large semi-solid temperature range of 60°C, was chosen as filler metal. Oxide films on the Al/Mg surfaces were removed despite the semi-solid state of the filler metal at 430°C. Al–Mg–Zn IMCs were observed inside the joint at 667?W and 5?s. The IMCs was reduced as ultrasonication time was prolonged. At high power of 1000?W, short ultrasonication time was needed to guarantee that no IMCs remained inside the joint. Otherwise, new IMCs formed because of serious cavitation erosion on substrates. Ultrasonication time of 20?s was unable to completely eliminate IMCs and solid phases at 423°C. |
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| Keywords: | Intermetallic compound semi-solid ultrasonic brazing ultrasonication power time |
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