Influence of in-plane and out-of-plane machining on the surface topography,the removal mechanism and the flexural strength of 2D C/C-SiC composites

Ceramic Matrix Composites (CMCs) are increasingly demanded especially for the production of structural components for several industries such as aerospace because of their excellent thermo-mechanical and fatigue properties. As one of the last production steps final machining is necessary to meet the required tolerances. From the economic point of view final machining of CMCs is highly critical and special knowledge is assumed to avoid irreparable damage, because of their heterogeneous, anisotropic and brittle nature. In this work diamond grinding and diamond milling have been applied to a 2D C/C-SiC composite at various feed rates and cutting speeds and in both main laminate directions, in-plane and out-of-plane. The microstructures of in-plane and out-of-plane machining indicate different material removal mechanisms due to different composite architecture. Increasing feed rate leads generally to more surface defects and consequently to higher roughness. Little influence on the four-point-bending strength was observed when changing the machining speed.